发明名称 BONDING APPARATUS AND BONDING METHOD
摘要 <p>A mounting apparatus (1), i.e., one example of bonding apparatuses, bonds a bonding sheet to a work disposed on a table (80). The apparatus is provided with: a strip-like material supporting mechanism (10), which supports a strip-like material (M) wherein a film for forming the bonding sheet is bonded on one surface of the base sheet; a precut mechanism (20) which makes cuts in the film corresponding to the size of the work and forms the bonding sheets, which are continuous in the longitudinal direction of the strip-like material (M) and are in line-contact with each other; and a bonding mechanism (50), which peels the bonding sheet from the base sheet and bonds the bonding sheet to the work.</p>
申请公布号 WO2011115022(A1) 申请公布日期 2011.09.22
申请号 WO2011JP55843 申请日期 2011.03.11
申请人 OHMIYA INDUSTRY COMPANY LIMITED;MIYACHI KENJI;KAKIMOTO KAZUHIRO 发明人 MIYACHI KENJI;KAKIMOTO KAZUHIRO
分类号 H01L21/683;H01L21/301 主分类号 H01L21/683
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