| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating resin easily developing high adhesive force to a wiring conductor even when a rugged feature on the surface of an insulating resin layer is small, and to provide a wiring board and a method for manufacturing a wiring board. <P>SOLUTION: The wiring board is obtained by forming an insulating resin layer on a board having a circuit of a wiring conductor, wherein the layer comprises a thermosetting insulating resin composition containing (A) an epoxy resin having at least two epoxy groups in one molecule, (B) an active ester group-containing compound and (D) an epoxy resin curing accelerator; then curing the insulating resin layer by heat; irradiating the layer with UV rays; and forming a wiring by plating on the insulating resin layer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
