发明名称 HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus that reduces sticking of foreign matter on a substrate to improve productivity. SOLUTION: The heat treatment apparatus includes a heating section which heats the substrate stored in a storage chamber, a first temperature detection section which detects temperature nearby the heating section, a second temperature detection section which is located closer to the substrate than the first temperature detection section and detects temperature nearby the substrate, and a control section which performs heating control over the heating section based upon the detected temperature of the first temperature detection section for a predetermined time after the substrate is put in a furnace. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187768(A) 申请公布日期 2011.09.22
申请号 JP20100052599 申请日期 2010.03.10
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKAMURA IWAO;IZUMI MANABU
分类号 H01L21/265;F27D19/00;F27D21/00;H01L21/22;H01L21/31 主分类号 H01L21/265
代理机构 代理人
主权项
地址