SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING THE PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a printed wiring board, which has no size limit since an expensive vacuum facility is not required for the manufacturing the same, does not use an organic adhesive, has high density and high performance, and is sufficiently thinned by using various kinds of base materials without being limited from the quality of the base materials, and also to provide a printed wiring board using the substrate and a method for producing the printed wiring board. SOLUTION: The substrate 1 for a printed wiring board includes: an insulative base material 10; and a conductive layer for covering the surface of the base material 10. The base material 10 has a through-hole 11 penetrating through the base material 10, and the conductive layer includes a conductive ink layer 20 containing metal particles for covering the entire surface of an inner hole of the through-hole 11 and both the front and rear surfaces of the base material 10. COPYRIGHT: (C)2011,JPO&INPIT