| 摘要 |
PROBLEM TO BE SOLVED: To provide a low cost method for achieving a non-lead type molded package. SOLUTION: The method includes the steps of: fixing one principal plane of a metal pattern 100 to a fixing plate 110 (plate bonding step (a)); forming a layer made of a mold material 11 on the surface of the metal pattern 100 to form a structure in which a semiconductor chip or the like is sealed with the mold material 11 (molding step (b)); half-cutting two regions, each locating outside the both sides of a section bar 101 parallel to the section bar 101 using mold-material cutting blades 201, 202, respectively (molding material cutting step (c)); cutting the sides of the first trench 251 and the second trench 252, each neighboring to the section bar 101, parallel to the section bar 101 using cutting blades 203, 204, respectively (cutting step (e)); and separating the fixing plate 110 by dissolving the adhesive with a solvent or the like (plate separation step). COPYRIGHT: (C)2011,JPO&INPIT
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