发明名称 TOUCH PANEL AND THE MANUFACTURING METHOD THEREOF
摘要 A touch panel structure and the manufacturing method thereof are disclosed, in which the manufacturing method includes the steps of: providing a bonding layer; and forming a conductive pattern layer on the bonding layer; wherein the conductive pattern layer is composed of at least one first and at least one second major conductors with an insulation layer interposed between the first and the second major conductors. Comparing with the prior art for manufacturing touch panels, the disclosure is advantageous in material cost, production cost, and production yield; moreover, the panel lamination process can be simplified and the touch panel structure can be joined to a planar or curvy panel and facilitate the design of a thinner product.
申请公布号 US2011227842(A1) 申请公布日期 2011.09.22
申请号 US201113045105 申请日期 2011.03.10
申请人 WINTEK CORPORATION 发明人 LIN YI-CHUN;WU MING-KUNG;LI HSIAO-PING;HUANG PING-WEN
分类号 G06F3/041;H05K3/28 主分类号 G06F3/041
代理机构 代理人
主权项
地址