| 摘要 |
<p>Provided is an arrangement equipped with a detection process wherein signal strengths at sampling points on panels are detected by emitting charged beams; a binarization process wherein those signal strengths at sampling points which are detected in the detection process are binarized, thereby obtaining binarized images; a comparison process wherein shapes included in binarized images obtained in the binarization process are regarded as shapes to be compared, and wherein the aforementioned shapes to be compared are compared with preliminarily registered shapes, thereby performing comparisons; and a defect determination process wherein, from comparison results in the comparison process, it is determined whether registered shapes are included in compared shapes, wherein if at least one registered shape is included in the compared shapes, it is determined that the pixels which include the aforementioned compared shapes are defective, and wherein if none of the registered shapes whatsoever are included in the compared shapes, it is determined that the pixels which include the aforementioned compared shapes are normal. In the aforementioned arrangement, without being affected by noise contents added to detected signals, defects are detected, thereby conducting array inspection.</p> |
