| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad capable of uniformizing planarity while suppressing scratches on a material to be polished. <P>SOLUTION: The polishing pad 10 has a urethane sheet 2 formed by a wet-coagulation method. A base material 8 is laminated on the back surface side of the urethane sheet 2. The base material 8 has a sheet-like main material part 8a having plasticity and a sub material part 8b having a Shore A hardness smaller than that of the main material part 8a and a thickness thinner than that thereof. A plurality of grooves are concentrically formed at a surface side coming into contact with an adhesive layer 7a at the main material part 8a and a resin of which the sub material parts 8b are formed is filled into the grooves. The sub material parts 8b are equally arranged at the main material part 8a. When polishing pressure is applied, difference is caused in pressing force applied to polishing particles between the processing surface of the material to be polished and the polishing surface P of the polishing pad 10 so that the polishing particles are easily moved. <P>COPYRIGHT: (C)2011,JPO&INPIT |
