| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition film for forming a forward tapered or rectangular pattern with high resolution, and having excellent heat resistance, even if the film is thick. <P>SOLUTION: The photosensitive resin composition film contains (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing polymerizable compound, (c) inorganic particles with an average particle size of 20 nm-1 μm, and (d) a photopolymerization initiator. <P>COPYRIGHT: (C)2011,JPO&INPIT |
