| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus being made more compact and thinner wherein a heat dissipation part the electronic apparatus has, and electronic component loaded in a socket, removably are thermally connected to each other. <P>SOLUTION: The electronic apparatus has the socket 1 for electronic component which is loaded with the removable electronic component 2, and the heat dissipation part 8, wherein the socket 1 for electronic component has a thermal connection part 6 to be thermally connected to the electronic component 2, and the electronic component 2 is thermally connected to the heat dissipation part 8 through the thermal connection part 6 when in operation. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
