发明名称 METHOD AND DEVICE FOR FORMING STACKED STRUCTURE INCLUDING AMORPHOUS CARBON FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for improving adhesion between an underlayer and an amorphous carbon film. SOLUTION: The method for forming a stacked structure including the amorphous carbon film on the underlayer, includes steps of: supplying an organic silicon gas on the underlayer to form an initial layer including a Si-C bond on the underlayer (t4); and forming the amorphous carbon film on the underlayer with a heating film formation (t6) supplying a film forming gas containing hydrocarbon gas on the underlayer on the surface of which the initial layer is formed. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011181903(A) 申请公布日期 2011.09.15
申请号 JP20110009705 申请日期 2011.01.20
申请人 TOKYO ELECTRON LTD 发明人 OKADA MITSUHIRO;TOJO YUKIO
分类号 H01L21/205;C23C16/26;C23C16/32;C23C16/34;H01L21/31 主分类号 H01L21/205
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