发明名称 TILE STICKING STRUCTURE, TILE STICKING METHOD, AND SEALING JOINT REPAIRING METHOD FOR BACKING PANEL
摘要 PROBLEM TO BE SOLVED: To provide a tile sticking structure, a tile sticking method and a sealing joint repairing method for a backing panel, which peels tiles stuck on the joint of the backing panel to facilitate repairing of the sealing join of the backing panel. SOLUTION: A conductive thin band body 8 is stuck on the surface edge of the backing panel 1 so as to continue along the joint of the backing panel 1. A thermoplastic adhesive agent 60 is coated over the entire surface of the backing panel 1 including the thin band body 8, allowing the tiles 7 to be stuck so as to overstride the joints of the backing panels 1. The thin band body is heated from the surface side of the tile 7 through electromagnetic induction heating, causing the adhesive agent 60 coated on the surface of the thin band body to be softened, thereby easily peeling off only the tiles 7 interfering the joint of the backing panels 1. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011179260(A) 申请公布日期 2011.09.15
申请号 JP20100045819 申请日期 2010.03.02
申请人 SEKISUI HOUSE LTD 发明人 FUJIIE MITSUO;MORIMOTO MASARU
分类号 E04F13/08;E04F13/21 主分类号 E04F13/08
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