发明名称 |
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE |
摘要 |
In an electronic device having multilayer resin interconnection layers, it is desired to reduce the warp of its support substrate. It is manufactured by: forming a lower layer including a via and a first insulating part on the support substrate; and forming an intermediate layer including a first interconnection and a second insulating part covering the first interconnection on the lower layer. The lower layer is formed by: forming the first insulating part on a first circuit region and a first region surrounding it; and forming the via on the first circuit region. The intermediate layer is formed by: forming the first interconnection on the first circuit region; forming a film of the second insulation part to cover the lower layer; and removing the second insulating part on the first region such that an outer circumferential part of an upper surface of the lower layer part is exposed.
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申请公布号 |
US2011221071(A1) |
申请公布日期 |
2011.09.15 |
申请号 |
US201113045219 |
申请日期 |
2011.03.10 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
MOTOHASHI NORIKAZU;SOEJIMA KOUJI;KURITA YOICHIRO |
分类号 |
H01L21/84;H01L23/48 |
主分类号 |
H01L21/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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