发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem that wiring resources of the whole integrated circuit are likely to be deficient when the integrated circuit of a semiconductor device is designed by automatic wiring, and static signal wiring for simultaneously supplying static signals such as an SMC (Scan Mode Control) signal to a plurality of circuit cells is arranged in the same wiring layer with normal signal wiring. SOLUTION: In the semiconductor device, the static signal wiring for simultaneously supplying static signals to the plurality of circuit cells is arranged at the lower layer part with power supply wiring and ground wiring. Consequently, the normal signal wiring is freely arranged at an upper layer part, and wiring properties, particularly, in the automatic wiring are expected to be improved. Consequently, reduction in total area as the whole integrated circuit, reduction in manufacturing cost as the whole semiconductor device, etc., are expected. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011181868(A) 申请公布日期 2011.09.15
申请号 JP20100047522 申请日期 2010.03.04
申请人 RENESAS ELECTRONICS CORP 发明人 TANAKA YUKIKO
分类号 H01L21/82;H01L21/822;H01L27/04 主分类号 H01L21/82
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