| 摘要 |
PROBLEM TO BE SOLVED: To provide a plug-in package that can readily protect packaged electronic components at the time of transfer, storage, and so on. SOLUTION: Provided is the plug-in package that has a substrate on which electronic components are packaged and a guide-pin receiving part 1000 fixed at the periphery of the substrate, wherein the plug-in package is slid and stored on a shelf. When the guide-pin receiving part is slid and stored on the shelf, the guide-pin fitting hole 1010 is directed in parallel to the substrate, and when the guide-pin receiving part is not slid and stored on the shelf, the guide-pin fitting hole is directed, in a direction which is deemed vertical to the substrate. COPYRIGHT: (C)2011,JPO&INPIT
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