| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of setting measurement and inspection conditions which enables setting of high-precision measurement and inspection conditions irrespective of process variations and to provide a computer program. SOLUTION: As one embodiment to acheive the subject purpose, a method of setting measurement conditions and a computer program are proposed, wherein measurement using a charged particle beam device is performed on a plurality of patterns formed with different manufacturing conditions to select measurement conditions in which the differences or variance between reference dimensions of the plurality of patterns and the measurement results are relatively small. The reference dimensions of the plurality of patterns may be obtained by measuring the plurality of patterns by an Atomic Force Microscope: AFM, or alternatively, may be obtained on the basis of sectional shapes or the like of the patterns obtained by applying simulation to semiconductor pattern design data. COPYRIGHT: (C)2011,JPO&INPIT |
