| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of heating a part in a processing chamber of a semiconductor manufacturing apparatus that heats the part in the processing chamber efficiently with simple constitution, and to provide the semiconductor manufacturing apparatus. <P>SOLUTION: The present invention relates to the method of heating the part in the processing chamber of the semiconductor manufacturing apparatus having a substrate stored in the processing chamber and performing a predetermined process on the substrate. A heating light source, which generates heating light having a wavelength band capable of passing through a first part in the processing chamber and being absorbed into a second part in the processing chamber made of a material different from that of the first part in the processing chamber, is provided outside the processing chamber, and the heating light is passed through the first part in the processing chamber and irradiates the second part in the processing chamber with the heating light, thereby heating the second part in the processing chamber. <P>COPYRIGHT: (C)2011,JPO&INPIT |
