| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of reducing an effect of fanned heat between a housing receiving an electronic circuit board and a housing receiving a power circuit board. <P>SOLUTION: A booster (electronic apparatus) 10 includes an electronic circuit board, a first housing 11 receiving the electronic circuit board, a power circuit board and a second housing 13 receiving the power circuit board. The booster is constituted so that a space 32 is formed between the first housing 11 and the second housing 13. In order to form the space 32, for example, a plurality of spacers 31 are provided between the first housing 11 and the second housing 13. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
