MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board for certainly connecting an IC chip and a passive component.

SOLUTION: There exist two kinds of connection terminals including an IC chip connection terminal 41 and a capacitor connection terminal 42 that is larger in area than the IC chip connection terminal 41 on an upper surface 31 of a wiring stacked part 30 in a multilayer wiring board 10. The capacitor connection terminal 42 comprises a terminal upper part 42a and a terminal lower part 42b. The terminal upper part 42a is formed on a resin insulating layer 24 of the uppermost outer layer. The terminal lower part 42b is arranged corresponding to each of openings 36 formed at a plurality of places that are in the inner side region of the terminal upper part 42a in the resin insulating layer 24. An upper surface of the terminal upper part 42a is higher in height than the surface of the resin insulating layer 24, and an upper surface of the IC chip connection terminal 41 and the terminal lower part 42b are lower in height than the surface of the resin insulating layer 24.

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