发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ADHESIVE FILM, AND LIGHT-RECEIVING DEVICE |
摘要 |
A photosensitive resin composition includes (A) an alkali-soluble resin, (B) an epoxy resin, and (C) a photopolymerization initiator, the epoxy resin (B) being an epoxy resin having a naphthalene skeleton and/or an epoxy resin having a triphenylmethane skeleton. A semiconductor device including a semiconductor wafer, a transparent substrate, and a spacer formed by a photosensitive adhesive film produced using the photosensitive resin composition does not suffer from condensation of dew. A light-receiving device having excellent reliability can also be obtained.
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申请公布号 |
US2011221017(A1) |
申请公布日期 |
2011.09.15 |
申请号 |
US200913128021 |
申请日期 |
2009.11.05 |
申请人 |
SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
TAKAHASHI TOYOSEI;SHIRAISHI FUMIHIRO;SATO TOSHIHIRO |
分类号 |
H01L31/00;C08J3/28;C09J161/14;C09J163/00 |
主分类号 |
H01L31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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