发明名称 |
Electroless metal deposition for micron scale structures |
摘要 |
<p>A method for electroless metal deposition on a surface in a finely dimensioned space (e.g. the bore of a hollow fibre) comprises introducing into said space an electroless plating solution that has a nil or relatively low plating rate at normal room temperature, and there after heating said structure to an elevated temperature for a period sufficient to cause metal to plate on the wall surface. The steps of introducing and heating may be repeated as necessary to build up a required thickness.</p> |
申请公布号 |
AU2010217389(A1) |
申请公布日期 |
2011.09.15 |
申请号 |
AU20100217389 |
申请日期 |
2010.02.25 |
申请人 |
BAE SYSTEMS PLC |
发明人 |
DUNLEAVY, MICHAEL;HAQ, SAJAD;HUCKER, MARTYN JOHN |
分类号 |
C23C18/16;B29C70/06;C23C18/44 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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