发明名称 |
MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, AND OSCILLATOR |
摘要 |
An electronic device package manufacturing method includes: forming a metal film on both surfaces of the cover substrate so that the metal film on one surface and the metal surface on the other surface conduct with each other; aligning and superimposing the cover substrate and the base substrate; and bonding the base substrate and the cover substrate together via the metal film by anodic bonding by bringing a negative electrode plate into contact with the base substrate on an entire surface opposite to a surface bonded to the cover substrate, bringing a positive electrode plate into contact with the cover substrate on an entire surface opposite to a surface bonded to the base substrate, and applying a voltage between the positive and negative electrode plates. The base substrate and the cover substrates can be thus bonded together via the metal film by anodic bonding in a stable manner. |
申请公布号 |
KR20110101080(A) |
申请公布日期 |
2011.09.15 |
申请号 |
KR20110019330 |
申请日期 |
2011.03.04 |
申请人 |
SEIKO INSTRUMENTS INC. |
发明人 |
YOSHIDA YOSHIFUMI |
分类号 |
H01L23/02;H01L23/12;H01L23/48 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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