Device for materials processing using laser radiation

摘要

The processor has a laser beam source (S) which emits pulsed laser radiation (3) that interacts with a material (5), a lens (6) which focuses the radiation in the material on a centre of interaction (7). A scanner (10) adjusts the position of the centre of interaction in the material and a controller (17) controls the scanner and beam source so that a sectioned area (9) is formed in the material by lining up interaction zones. The laser beam source and the scanner are controlled with adjacent centers of interaction lie at a distance of less than or equal to 10 microns in relation to one another. An independent claim is included for a method.