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发明名称
Super high-speed chip to chip interconnects
摘要
Disclosed herein is a technique for increasing bandwidth for super high speed interconnects. The invention combines an electrical signal with an optical signal to provide a bandwidth greater than is possible with each individual signal.
申请公布号
US8019187(B1)
申请公布日期
2011.09.13
申请号
US20090542492
申请日期
2009.08.17
申请人
BANPIL PHOTONICS, INC.
发明人
DUTTA ACHYUT KUMAR
分类号
G02B6/12
主分类号
G02B6/12
代理机构
代理人
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