| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device high in mounting durability of electronic components in a heat cycle time. SOLUTION: The electronic device 1 includes: a mounting substrate 2; a first electrode pad 9 and a second electrode pad 10 formed on the mounting substrate 2; a first electrode component 3 and a second electrode component 4 connected to the first electrode pad 9 and the second electrode pad 10 on the mounting substrate 2 respectively and mounted in proximity to each other on the mounting substrate 2; first adhesive resin 5 bonding the first electronic component 3 to the mounting substrate 2 and pressed out toward the second electronic component 4 from the first electronic component 3; second adhesive resin 6 bonding the second electronic component 4 to the mounting substrate 2 and pressed out toward the first electronic component 3 from the second electronic component 4; and a non-adhesive region 7 formed on the mounting substrate 2 to partition the first electronic component 3 from the second electronic component 4 and to repel the first adhesive resin 5 and second adhesive resin 6 before cured. The first adhesive resin 5 and the second adhesive resin 6 are separated by the non-adhesive region 7. COPYRIGHT: (C)2011,JPO&INPIT |
