| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high density-compliant IC without generating a virtual pixel, even if sensor chips are arranged at a predetermined pitch, and a contact image sensor which uses the IC. <P>SOLUTION: The IC for a message sensor includes light-receiving elements 10a, arranged linearly, adjacent to one another on a surface of a rectangular semiconductor substrate having opposite sides parallel to each other, and installed by being inclined, with respect to at least a set of opposite sides from a predetermined position of one-side opposite side of the semiconductor substrate to a predetermined position of the other-side side; and an interpolation element(s), 10b arranged at one end or both ends of a set of opposite sides on the side of a region where an angle formed by the linearly-arranged light reception elements 10a and the set of opposite sides becomes wide, having an inclination angle, with respect to the linearly-arranged light-receiving elements 10a, and receiving light outside the linearly-arranged light reception elements 10a. <P>COPYRIGHT: (C)2011,JPO&INPIT |
