发明名称 METHOD FOR MANUFACTURING SOI SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce manufacturing cost of an SOI substrate or to improve yield of the SOI substrate. <P>SOLUTION: A method for manufacturing an SOI substrate includes the steps of irradiating a single crystal semiconductor substrate with ions to form an embrittled region in the single crystal semiconductor substrate, bonding the single crystal semiconductor substrate to a base substrate with an insulating film therebetween, and separating the single crystal semiconductor substrate and the base substrate at the embrittled region to form a semiconductor layer over the base substrate with the insulating film therebetween. In the step of forming the embrittled region, ion species which are not mass-separated are used as the ions and a temperature of the single crystal semiconductor substrate is set to 250°C or higher during irradiation with the ions. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011176295(A) 申请公布日期 2011.09.08
申请号 JP20110012635 申请日期 2011.01.25
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 HIZUKA JUNICHI;ONUMA HIDETO
分类号 H01L27/12;H01L21/02;H01L21/265;H01L21/336;H01L29/786 主分类号 H01L27/12
代理机构 代理人
主权项
地址