发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD |
摘要 |
According to one embodiment, a first substrate and a second substrate are pressed from an opposite surface of a joint surface of the second substrate such that a joint surface of the first substrate and the joint surface of the second substrate are in contact with each other. The second substrate is restrained by a member to provide a gap between the joint surfaces. It is determined, based on a temporal change of a joint interface calculated based on an image imaged from the opposite surface side of the joint surface, whether joining is normally performed.
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申请公布号 |
US2011217795(A1) |
申请公布日期 |
2011.09.08 |
申请号 |
US201113035182 |
申请日期 |
2011.02.25 |
申请人 |
TANIDA KAZUMASA;YAMAGUCHI NAOKO;HONGO SATOSHI;TAKUBO CHIAKI;NUMATA HIDEO |
发明人 |
TANIDA KAZUMASA;YAMAGUCHI NAOKO;HONGO SATOSHI;TAKUBO CHIAKI;NUMATA HIDEO |
分类号 |
H01L21/66;B23P19/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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