SUBSTRATE TREATING METHOD, AND SUBSTRATE TREATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate treating method and a substrate treating apparatus that stably process the substrate. SOLUTION: The treating apparatus 1 includes a tank 11 into which a liquid L is supplied and in which the substrate 2 is dipped in the supplied liquid L, and a holding portion 13 configured to hold the substrate 2 arranged in the tank 11 with a substrate surface of the substrate 2 substantially parallel to a perpendicular direction. The treating apparatus 1 is configured such that when the liquid L is made to flow from a supply port 111 to a drain port 112 of the tank 11, the liquid L flows perpendicularly from an upper side to a lower side along the substrate surface. COPYRIGHT: (C)2011,JPO&INPIT