| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which provides a molding having improved surface smoothness when the composition is laminated on a member having a hole or unevenness in a surface thereof, and to provide a molding. SOLUTION: The resin composition contains an epoxy resin, an active ester compound, first silica having a mean particle diameter of 0.1-10 μm, and second silica having a mean particle diameter of ≥1 nm and <100 nm. The molding is obtained by molding the composition into a sheet-like shape. COPYRIGHT: (C)2011,JPO&INPIT
|
