| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module that can be miniaturized. SOLUTION: The circuit module includes a substrate 1 on which an electronic component 3 is mounted, a shield case 2, and a solder 5 for joining the substrate 1 and the shield case 2. A leg part 2f superposed with part of a side edge 1b of the substrate 1 is extended from a predetermined side 2b of the shield case 2, and part of the side edge 1b of the substrate 1 and the leg 2f of the shield case 2 are joined by the solder 5. An opening 2g for exposing a superposed section of part of the side edge 1b of the substrate 1 and the leg 2f of the shield case 2 is formed on a predetermined side 2b of the shield case 2. COPYRIGHT: (C)2011,JPO&INPIT
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