| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor component that eliminates the need to charge an underfill resin after the semiconductor component is mounted on a circuit board, and improves drop impact resistance. SOLUTION: There is provided the method for mounting the semiconductor component 2 that provides a joint part 6 for joining the semiconductor component 2 and circuit board 4 together using a thermosetting resin composition 1 containing solder particles and a flux component. Each electrode 5 of the circuit board 4 is coated with the thermosetting resin component 1. A sealing material 9 which contains no flux component is applied to cover the thermosetting resin composition 1. In a state wherein the thermosetting resin composition 1 and sealing material 9 are both not cured, the semiconductor component 2 and circuit board 4 are put one over the other such that terminals 3 of the semiconductor component 2 and the electrodes 5 of the circuit board 4 face each other, and heated. The thermosetting resin composition 1 is cured to provide the joint part 6 composed of a solder part 7 formed by fusing and integrating the solder particles, and a resin cured part 8 covering the periphery of the solder part 7. The sealing material 9 is cured to seal the periphery of the joint part 6. COPYRIGHT: (C)2011,JPO&INPIT |
