| 发明名称 |
Electroless Plating System |
| 摘要 |
An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
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| 申请公布号 |
US2011214608(A1) |
申请公布日期 |
2011.09.08 |
| 申请号 |
US201113111859 |
申请日期 |
2011.05.19 |
| 申请人 |
IVANOV IGOR;TAS ROBERT D;KULKARNI SHASHANK RAVINDRA;RULKENS RON |
发明人 |
IVANOV IGOR;TAS ROBERT D.;KULKARNI SHASHANK RAVINDRA;RULKENS RON |
| 分类号 |
B05C3/02 |
主分类号 |
B05C3/02 |
| 代理机构 |
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