| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board capable of cutting a matrix substrate by a dicing process at a boundary of wiring board regions with favorable workability while suppressing the occurrence of failures such as chipping, in the multiple patterning wiring board with the matrix substrate formed of a glass ceramic sintered body. SOLUTION: In the multiple patterning wiring board 9a formed by vertically and horizontally arranging a plurality of the wiring board regions 2 on the matrix substrate 1 formed of the ceramic sintered body and divided by the dicing process at the boundaries 2b of the wiring board regions 2, non-sintered ceramic particle layers 5a are deposited on parts positioned on the boundaries 2b of the wiring board regions 2 of the matrix substrate 1. The non-sintered ceramic particle layer 5a accelerates the exposure of new abrasive grains of a dicing blade for cutting the matrix substrate 1 to make it possible to cut the matrix substrate 1 while suppressing the occurrence of failures such as chipping. COPYRIGHT: (C)2011,JPO&INPIT |
