发明名称 |
Heat-dissipating device for supplying cold airflow |
摘要 |
<p>A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.</p> |
申请公布号 |
EP2363882(A1) |
申请公布日期 |
2011.09.07 |
申请号 |
EP20100155052 |
申请日期 |
2010.03.01 |
申请人 |
CPUMATE INC.;GOLDEN SUN NEWS TECHNIQUES CO., LTD. |
发明人 |
LIN, KUO-LEN;CHEN-HSIANG LIN, LIN;HSU, KEN;CHENG, CHIH-HUNG |
分类号 |
H01L23/367;F28D15/02;F28F1/12;G06F1/20;H01L23/38;H01L23/427;H01L23/467;H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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