| 摘要 |
<p>The switch (1) has a copper layer (6) provided in an upper surface (5) of a printed circuit board (4) for producing capacitance field (7). The layer is firmly connected with an inner surface (8) of a thin-walled cover plate (3). Sensor surfaces (17, 18) are formed in the board and electrically coupled with a microcontroller (13) as a controlling and evaluating unit by integrated circuits (11, 12). The board acts as insulation between the layer and the sensor surfaces, and the circuits are alternatively controlled by the microcontroller for measuring the capacitance field.</p> |
