| 摘要 |
<p>A connection terminal (80) to mount an electronic component (2) is formed on a first base material in which a metal foil is disposed on a support body so as to be detachable. Then, the connection terminal (80) and a bump (20) of an electronic component (2) are electrically connected and underfill material (4) is filled between the electronic component (2) and the first base material. Next, insulative material (3) is disposed on the first base material to cover the electronic component (2). Then, the support body and the metal foil are detached, and the unnecessary portion of the exposed metal foil is etched away. Accordingly, a wiring board (1) with a built-in electronic component is obtained.</p> |
