发明名称 Method for manufacture of piezoelectric substrate for a saw device
摘要 The present invention provides a composite structure having a supporting substrate between a piezoelectric substrate and a compensation layer. The materials used to form the piezoelectric substrate and the compensation layer in isolation, have higher thermal coefficients of expansion (TCE) relative to the TCE of the materials forming the supporting substrate. Once the composite structure is created, the piezoelectric substrate and compensation layer tend to expand and contract in a similar manner as temperature changes. The expansion and contraction forces applied to the supporting substrate by the piezoelectric substrate due to temperature changes are substantially countered by similar opposing forces applied by the compensation layer, resulting in the opposing forces substantially counteracting one another. Due to the counteraction, the composite structure resists bending or warping, reducing expansion and contraction and increasing stress of the piezoelectric substrate, and thus reducing the effective TCE and TCF of the piezoelectric substrate.
申请公布号 US8011074(B2) 申请公布日期 2011.09.06
申请号 US20080014191 申请日期 2008.01.15
申请人 RF MICRO DEVICES, INC. 发明人 BHATTACHARJEE KUSHAL;ZHGOON SERGEI
分类号 H01L41/22;H04R17/00 主分类号 H01L41/22
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