发明名称 High mobility CMOS circuits
摘要 Semiconductor structure formed on a substrate and process of forming the semiconductor. The semiconductor includes a plurality of field effect transistors having a first portion of field effect transistors (FETS) and a second portion of field effect transistors. A first stress layer has a first thickness and is configured to impart a first determined stress to the first portion of the plurality of field effect transistors. A second stress layer has a second thickness and is configured to impart a second determined stress to the second portion of the plurality of field effect transistors.
申请公布号 US8013392(B2) 申请公布日期 2011.09.06
申请号 US20070863757 申请日期 2007.09.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DORIS BRUCE B.;GLUSCHENKOV OLEG G.;ZHU HUILONG
分类号 H01L27/01;H01L21/8238 主分类号 H01L27/01
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