| 摘要 |
PROBLEM TO BE SOLVED: To provide an electric circuit module that is improved in manufacturing yield by preventing an electric circuit from short-circuiting owing to a solder ball formed between a semiconductor chip and a passive component. SOLUTION: A substrate 2 including a substrate portion 2, a semiconductor chip terminal 3 for mounting the semiconductor chip 4 at least on one surface of the substrate portion 2, and a passive component terminal 6 for mounting the passive component 7 at least on the one surface of the substrate portion 2 is provided with a conductor portion 9 between the semiconductor chip terminal 3 and the nearby passive component terminal 6 to prevent the electric circuit from short-circuiting owing to the solder ball formed between the semiconductor chip and passive component. COPYRIGHT: (C)2011,JPO&INPIT
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