| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology that suppress exfoliation of a transparent member. SOLUTION: A method of manufacturing a semiconductor device includes a first step of preparing components with a lead frame having a frame portion and a lead extended therefrom, a resin member connected to the lead, and a connecting member for connecting the frame portion and resin member, a second step of mounting a semiconductor element on the resin member so as to connect a pad of the semiconductor element to the lead, a third step of removing the lead from the frame portion, a fourth step of adhering a transparent member to the resin member so that the semiconductor element is sealed after the third step, and a fifth step of separating the semiconductor device having the lead, resin member, transparent member and semiconductor element from the frame portion by cutting the connecting member after the fourth step. The connecting member includes a portion where a load required for cutting the same is smaller than that for the lead. COPYRIGHT: (C)2011,JPO&INPIT |
