发明名称 MOLDED TRANSPARENT RESIN AND PROCESS FOR PRODUCING THE SAME
摘要 The present invention provides a clear resin molded body which has high heat resistance that can be used in the reflow soldering process using Pb-free solder, which has high transparency that can be used for an optical member, and which can be easily produced, and also provides a method of producing the same. A clear resin molded body includes a molded body of a resin composition composed of a carbon-hydrogen-bond-containing fluororesin, in which the resin composition is crosslinked by irradiating the molded body with ionizing radiation at least once in an atmosphere at a temperature lower than the melting point of the fluororesin and at least once in an atmosphere at a temperature equal to or higher than the melting point of the fluororesin. A method produces the clear resin molded body.
申请公布号 US2011213089(A1) 申请公布日期 2011.09.01
申请号 US201013126984 申请日期 2010.08.02
申请人 YAMASAKI SATOSHI;HAYAMI HIROSHI;NAKABAYASHI MAKOTO 发明人 YAMASAKI SATOSHI;HAYAMI HIROSHI;NAKABAYASHI MAKOTO
分类号 C08F214/28;B29C35/10;C08F8/00 主分类号 C08F214/28
代理机构 代理人
主权项
地址