发明名称 |
MOLDED TRANSPARENT RESIN AND PROCESS FOR PRODUCING THE SAME |
摘要 |
The present invention provides a clear resin molded body which has high heat resistance that can be used in the reflow soldering process using Pb-free solder, which has high transparency that can be used for an optical member, and which can be easily produced, and also provides a method of producing the same. A clear resin molded body includes a molded body of a resin composition composed of a carbon-hydrogen-bond-containing fluororesin, in which the resin composition is crosslinked by irradiating the molded body with ionizing radiation at least once in an atmosphere at a temperature lower than the melting point of the fluororesin and at least once in an atmosphere at a temperature equal to or higher than the melting point of the fluororesin. A method produces the clear resin molded body.
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申请公布号 |
US2011213089(A1) |
申请公布日期 |
2011.09.01 |
申请号 |
US201013126984 |
申请日期 |
2010.08.02 |
申请人 |
YAMASAKI SATOSHI;HAYAMI HIROSHI;NAKABAYASHI MAKOTO |
发明人 |
YAMASAKI SATOSHI;HAYAMI HIROSHI;NAKABAYASHI MAKOTO |
分类号 |
C08F214/28;B29C35/10;C08F8/00 |
主分类号 |
C08F214/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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