MANUFACTURING METHOD OF MICROELECTRODE ARRAY

摘要

Disclosed herein is a processing method of a microelectrode array. A processing method of a microelectrode array includes: depositing a sacrificial layer on a silicon substrate; patterning a first polymer on the deposited sacrificial layer and then thermally curing the first polymer patterning a metal thin film on the first polymer to form a bonding pad site, an interconnection line and a recording pad site; closing the interconnection line site and coating a second polymer to pattern the bonding pad site and the recording pad site; depositing a seed layer on the second polymer and the metal thin film using a sputter; electroplating a metal on the bonding pad site and the recording pad site, thereby forming an electroplated layer; patterning a photoresist to open an upper portion of the electroplated layer; depositing platinum on the photoresist and the electroplated layer; and removing the photoresist.