| 摘要 |
PROBLEM TO BE SOLVED: To firmly attach a plating metal layer on an insulating resin layer with a flat surface. SOLUTION: The manufacturing method of multilayer wiring board includes (a) forming an insulating resin layer on a base structure equipped with base wiring, (b) arranging a particle which can form a hydroxyl group on an insulating resin layer surface and covering it with a protective resin film, (c) carrying out laser processing of a via hole penetrating through the protective resin film and insulating resin layer, and then reaching the base wiring, (d) removing smear by laser processing, (e) removing the protective resin film, (f) combining a coupling agent with a particle which can form the hydroxyl group, (g) carrying out electroless plating of a seed layer on the base wiring and insulating resin layer, and (h) carrying out electrolytic plating of a main wiring layer on the seed layer. COPYRIGHT: (C)2011,JPO&INPIT |
