| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for protecting a manufacturer by suppressing claims from a willful malice third party, which is caused by peeling-off a seal, by dispensing a manufacturing/transportation/sticking step of a seal by changing a step for sticking a seal (3) of an electronic substrate plate etc. of a pocket telephone, etc. SOLUTION: A die (5) is molded from a hot-melting material by using a hot-melder so as to mold directly a seal (7) on a substrate plate etc., whereby a production time and cost can be reduced and an action for PL law can be conducted. COPYRIGHT: (C)2011,JPO&INPIT
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