ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DEPOSITION ON A WORKPIECE WITH THROUGH HOLES DURING PLATING

摘要

A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.