发明名称 HEAT SINK
摘要 <p>Disclosed is a light-weight, low-cost and high-performance heat sink requiring less machining and capable of better heat dissipation performance. The disclosed heat sink is provided with a first heat exchange plate thermally connected on a first surface to a heat generating component and thermally connected to first heat-dissipating thin-plate fins, a second heat exchanger plate thermally connected on a first surface to second heat-dissipating thin-plate fins, a heat pipe thermally connecting a second surface of the first heat exchanger plate and a second surface of the second heat exchanger plate, and a heat exchanger block arranged so as to thermally connect to the side surface and top surface of the heat pipe and so as to hold the heat pipe from either side between said block and the second heat exchange plate.</p>
申请公布号 WO2011105364(A1) 申请公布日期 2011.09.01
申请号 WO2011JP53827 申请日期 2011.02.22
申请人 FURUKAWA ELECTRIC CO.,LTD.;ITO, SHINICHI;KAWABATA, KENYA;FURUMOTO, SHINICHI 发明人 ITO, SHINICHI;KAWABATA, KENYA;FURUMOTO, SHINICHI
分类号 H01L23/427;F28D15/02;H05K7/20 主分类号 H01L23/427
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