| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition superior in sensitivity and storage stability without causing discoloration on copper or copper alloy, and to provide a method for manufacturing a cured relief pattern using the photosensitive resin composition, and a semiconductor device. <P>SOLUTION: The photosensitive resin composition contains: (A) 100 pts.mass of a photosensitive resin; (B) 1-40 pts.mass of a sensitization agent; (C) 0.05-20 pts.mass of a copper discoloration prevention agent; and (D) a solvent. A water content in the photosensitive resin composition is 0.6-10 mass.%. <P>COPYRIGHT: (C)2011,JPO&INPIT |
| 申请公布号 |
JP2011169980(A) |
申请公布日期 |
2011.09.01 |
| 申请号 |
JP20100031580 |
申请日期 |
2010.02.16 |
| 申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
TAMURA NOBUSHI;FUJITA MITSURU |
| 分类号 |
G03F7/027;C08G73/10;C08G73/22;G03F7/004;G03F7/023;G03F7/037;G03F7/40;H01L21/027 |
主分类号 |
G03F7/027 |
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