| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure device reduced in size and lowered in price. <P>SOLUTION: The exposure device 10 which exposes a semiconductor wafer 40 having an alignment mark 42 on an upper surface, has: a stage 12 on which the semiconductor wafer is placed; a moving means 13 of moving the stage; a projecting means 26 of projecting light, spectral means 32 and 36 of spectrally diffusing the light projected by the projecting means into light traveling to a side face of the stage and light traveling to an upper surface of the stage; a position detecting means 26 of detecting the position of the stage by detecting reflected light of the light traveling to the side face of the stage; and a scattered light detecting means 30 of detecting whether there is scattered light generated when the alignment mark of the semiconductor wafer is irradiated with the light traveling to the upper surface of the stage. <P>COPYRIGHT: (C)2011,JPO&INPIT |
