| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer level lens module, having excellent shape accuracy and positional accuracy of a lens element formed on a glass wafer, and preventing adhesion of dust to the lens element and the occurrence of a bubble and defect in a manufacturing process. <P>SOLUTION: The method for manufacturing the wafer level lens module including a plurality of lenses at least on one surface of the glass wafer to have a one-to-one correspondence with a plurality of solid-state image pickup elements formed on a silicon substrate at least includes: a coating process of coating a photosensitive transparent resin 22 on a glass substrate 21 of a wafer size; an exposure process of exposing the photosensitive transparent resin layer to an ultraviolet ray 95 through a gradation mask 94 having a predetermined pattern; a development process of developing the photosensitive transparent resin by removing soluble component of thereof; and a fixing process of fixing the insoluble photosensitive resin layer. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
